Metallurgical failure analysis
Structural failure analysis
Characterization of materials (metals, plastics, ceramics, glasses)
FTIR (Fourier Transform Infrared Spectroscopy)
Particle analysis and identification
Electronic Component F/A
Device and component failures
Electronic assembly analysis
Component failure mechanisms
PWB construction analysis
Zoom magnification up to 50,000X
Elemental analysis of C (z=6) to U (z=92)
SEM Lab, Inc. is a failure analysis lab providing services to many branches of manufacturing, such as the electronics, medical or aerospace industries, where it is a vital tool used to determine the cause of a failure in order to keep it from recurring. At SEM Lab, Inc., we provide:
- Failure Analysis of Electronic Devices
- Failure Analysis of Medical Devices
- Failure Analysis of Ceramics and Plastics
- Metallurgical Failure Analysis
SEM Lab, Inc. performs materials analysis, identification and characterization of a wide variety of materials and processes. Materials such as metals, plastics, ceramics, glasses, and particles are commonly examined.
- General Materials Analysis
- Electronic Materials and Process Analysis
Electronic Component F/A
SEM Lab, Inc. is a failure analysis lab that specializes in failure analysis of electronic assemblies, printed-circuit-boards (PCBs), printed-wiring-boards (PWBs), and electronic components such as integrated circuits (ICs), memory chips, transistors, diodes, capacitors, resistors, LEDs, power modules, and many others. We have analyzed electronic devices, components and assemblies for ESD, EOS, shorts, opens, corrosion, solderability, vibration, thermal fatigue, connector failures, etc.
Failure Analysis Lab
SEM Lab, Inc. provides failure analysis, materials characterization, scanning electron microscopy (SEM) and FTIR services. We specialize in failure analysis of electronic assemblies, printed-circuit-boards (PCBs) or printed-wiring-boards (PWBs), and electronic components such as integrated circuits (ICs), memory chips, transistors, diodes, capacitors, resistors, light emitting diodes (LEDs), power modules, and many others.
Since 1997 we have developed relationships with over 450 client companies including many of the most prominent Fortune 500 electronic, medical and high technology companies in the world, as well as independent consultants and small businesses.
- SMT device with wetting problem
- Transistor failure
- BGA solder joint failure
- Particle residue in relay device.
- Pb dendrite
- Fatigue striations on a fracture surface