Images of Failures in Microelectronics Packaging

IMAPS Presentation

This paper is a collection of failures seen at SEM Lab, Inc., and include gold embrittlement, mechanical damage, solder joint failure, black pad syndrome, and various other failure mechanisms.

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To see SEM images of other failed components visit our electronic component failure analysis page .

A complete listing of all of our papers can be found here:

Papers

 

Images of Failures in Microelectronics Packaging and Assembly
Images of Failures in Microelectronics Packaging and Assembly