Electronic Component Failure Analysis Service
PCBs, PWBs, ICs, Chips, Transistors, Diodes, Capacitors, Resistors, LEDs, Power Modules, etc.
SEM Lab, Inc. is a failure analysis lab that specializes in failure analysis of electronic assemblies, printed-circuit-boards (PCBs), printed-wiring-boards (PWBs), and electronic components such as integrated circuits (ICs), memory chips, transistors, diodes, capacitors, resistors, LEDs, power modules, and many others. We have analyzed electronic devices, components and assemblies for ESD, EOS, shorts, opens, corrosion, solderability, vibration, thermal fatigue, connector failures, etc.
Component Failure Analysis
Failure mechanisms are different for every device. A more detailed look into the failures in specific devices can be found here:
- Identifying Counterfeit Components
- Medical Device Failure Analysis
Device Failure Analysis Documentation
Capacitors, Resistors, Inductors, Diodes, Transformers, LEDs, ICs, PWBs, BGAs, PCBAs
SEM Lab, Inc. has extensive experience analyzing problems such as generalized corrosion, bond pad corrosion, gold embrittlement, black pad syndrome (ENIG finished PWBs), plated-through-hole and via failures, electrical contact problems, wire bonds, BGAs, delamination, and electromigration. We also specialize in solder joint failures, microstructural characterization, and solder joint reliability. SEM Lab Inc. also offers solder joint analysis.
We have made available a collection of documents that describe some of the failure mechanisms we have seen at SEM Lab, Inc.
Electrical overstress (EOS) damage on metallization run on Op-Amp I
LED Die Fracture
Transistor failure caused by electrical overstress damage across most of the emitter region of the die.
Capacitor failure caused by a crack running through several opposing capacitor plates.