Failure Analysis Service

Metals, Ceramics and Plastics

SEM Lab, Inc. is a failure analysis lab providing services to many branches of manufacturing, such as the electronics, medical or aerospace industries, where it is a vital tool used to determine the cause of a failure in order to keep it from recurring.

Failure Analysis of Metals, Ceramics, and Plastics

Fractures


Examining the fracture surface of a failed part can provide important information regarding the failure mechanism. SEM imaging and microscopy can classify the type of failure as ductile or brittle, for example. It can also yield information about the cause of the fracture such as corrosion, fatigue, etc.

 

Failure Analysis of Electronic Components

ICs, LEDs, PWBs, PCBs, Transistors, Inductors, Resistors, Capacitors, Components and Assemblies


SEM Lab, Inc. provides analysis of integrated circuits (ICs), light emitting diodes (LEDs), printed wiring boards (PWBs), printed circuit boards (PCBs), transistors, inductors, resistors, capacitors, components and assemblies. We also provide analysis of medical devices. For a more detailed description of our electronic component failure analysis service, click on the link below.

Flexure crack in an MLCC.

Flexure crack in an MLCC.

Fracture of a bolt.

Fracture of a bolt as seen in the SEM.

SEM image of a ceramic sample.

SEM image of a ceramic sample.

Fatigue striations

Fatigue striations on the fracture surface of a stainless steel spring.

LED failure due to an open bond wire.

LED failure due to an open bond wire.

Dendritic growth on a PCBA.

Dendritic growth on a PCBA.