Materials Analysis Service

General Materials Analysis, Electronic Materials and Process Analysis

SEM Lab, Inc. performs materials analysis, identification and characterization of a wide variety of materials and processes. Materials such as metals, plastics, ceramics, glasses, and particles are commonly examined.

Electronic Materials and Process Analysis

Microstructural Characterization and Evaluation


SEM Lab, Inc. specializes in electronic materials and process characterization such as plating thickness and metallurgical evaluation, microstructural characterization, particle composition and shape characterization. We can provide expert materials support for electronic design and development, first article inspection, and lot-to-lot quality evaluations.

SEM Lab, Inc. also provides solder joint analysis and printed wiring board (PWB) construction analysis. More details about these services can be found here:

Solder Joint Analysis

PWB Construction Analysis

 

Materials Analysis

Metals, Plastics, Ceramics, Glasses, and Particles


In addition to Scanning Electron Microscopy (SEM) analysis and optical microscopy, SEM Lab, Inc. uses Energy Dispersive X-ray (EDX or EDS) analysis in conjunction with Fourier Transform Infrared Spectroscopy (FTIR) analysis to identify and characterize materials. More details about these services can be found here:

EDS Analysis

FTIR Analysis

SEM Analysis

Optical Microscopy

Particle Analysis

Fiber Analysis

 

HDI micro-via quality evaluation.

HDI micro-via quality evaluation.

Contamination

Using SEM analysis to determine that the contaminant on a paper product is potassium chloride.

Dielectric void in base metal electrode (BME).

Dielectric void in base metal electrode (BME).

BGA failure

Ball Grid Array (BGA) solder joint failure analysis.

PWB construction analysis for conductor layer thickness, dielectric thickness, plated copper thickness, layer-to-layer and registration.

PWB construction analysis for conductor layer thickness, dielectric thickness, plated copper thickness, layer-to-layer and registration.

Solder fatigue.

Solder fatigue.