Failure Analysis of Diodes
Diode Failures
The failure analysis of diodes usually involves variety of causes including electrical over-stress, electro-static discharge, die attachment porosity, other manufacturing defects.
Failures in diodes and a diode microsection are shown below.
Other device failure analysis information:
Diodes
Decapsulated diode.
SEM image of a shorted diode in cross-section. There are voids in all of the solder layers in the stack, indicated by the arrows..
The diode melt-through is visible in the top-right corner of the die.