This is an optical image of a shorted multilayer chip capacitor that shorted internally.
This is a BSE SEM image of the same capacitor after microsectioning that shows the original short developed at the intersection of a fracture that bridged the plates.
The original fracture was most likely caused by one of two stresses, (1) thermal shock due to reflow or touch up soldering or (2) bending stresses due to depaneling or subsequent bending of the CCA.
Check out SEM Lab, Inc. to learn more.