{ "query": "Quantifying Binder Loss in Silica Filled Underfill by EDS Mass Balance", "total": 22, "limit": 10, "catalog_generated_at": "2026-10-15T16:42:46.835686+00:00", "results": [ { "report_id": "SEM-EVIDENCE-0022", "slug": "underfill-binder-loss-eds-mass-balance", "title": "Quantifying Binder Loss in Silica Filled Underfill by EDS Mass Balance", "abstract": "When underfill turns white and chalky, an elemental comparison is only part of the explanation. In SEM Lab Case 3139, we extended quantitative EDS into an engineering mass balance to compare degraded epoxy-silica underfill with a control sample. The fitted silica fraction increased from 16.8 to 29.5 vol%, while the binder-to-silica volume ratio fell from 4.96 to 2.39. Using silica as a nonvolatile internal reference, this indicates approximately 52% less binder volume per unit silica in the degraded material. The paper connects that result with the observed chalking, cracking, and flaking, and explains the stoichiometry, density assumptions, and limits of the calculation. The result is a localized composition estimate, not a direct measurement of bulk shrinkage or proof of a specific cure defect.", "failure_modes": [ "binder loss", "underfill cracking", "chalking", "flaking" ], "technologies": [ "sensor underfill", "EDS mass balance", "composite volume fractions" ], "materials": [ "epoxy binder", "silica" ], "methods": [ "optical microscopy", "SEM", "EDS", "stoichiometric mass balance" ], "keywords": [ "underfill", "binder loss", "silica", "EDS", "mass balance", "Case 3139" ], "audience": [ "failure-analysis engineers", "reliability engineers", "printed-circuit-board engineers", "manufacturing engineers", "process engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "30.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/underfill-binder-loss-eds-mass-balance.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-10-09" }, { "report_id": "SEM-EVIDENCE-0021", "slug": "physical-composition-inorganic-fillers-solder-mask", "title": "Physical Composition of Inorganic Fillers in Printed Circuit Solder Mask", "abstract": "This paper converts archived SEM/EDS elemental measurements into estimated physical phase fractions for printed-circuit solder mask. The clean/reference cohort indicates approximately 10-11 vol% total inorganic filler in the modeled mask, with barium sulfate as the principal fitted filler and silica as a smaller but persistent secondary constituent. The paper explains the constrained-regression, stoichiometric, molar-mass, and density basis used to move from ZAF-corrected atomic percentages to mole, weight, and volume fractions. It also separates clean/reference acquisitions from residue-on-mask spectra and states the limits of localized SEM/EDS measurements, the binder surrogate, phase identification, and the small number of independent cases.", "failure_modes": [ "solder-mask formulation variation", "solder-mask cracking", "adhesion loss" ], "technologies": [ "physical composition of inorganic fillers in printed circuit solder mask", "solder-mask formulation", "barium sulfate filler", "silica filler", "filler volume fraction", "SEM/EDS interpretation", "constrained regression", "materials engineering", "process comparison" ], "materials": [ "solder mask", "barium sulfate", "silica", "epoxy binder" ], "methods": [ "SEM", "EDS", "nonnegative constrained regression", "stoichiometric mass-balance analysis" ], "keywords": [ "physical composition of inorganic fillers in printed circuit solder mask", "solder-mask formulation", "barium sulfate filler", "silica filler", "filler volume fraction", "SEM/EDS interpretation", "constrained regression", "materials engineering", "process comparison", "solder-mask formulation variation", "solder-mask cracking", "adhesion loss", "solder mask", "barium sulfate", "silica", "epoxy binder", "SEM", "EDS", "nonnegative constrained regression", "stoichiometric mass-balance analysis" ], "audience": [ "printed-circuit-board engineers", "materials engineers", "manufacturing engineers", "process engineers", "failure-analysis engineers", "reliability engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "30.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/physical-composition-inorganic-fillers-solder-mask.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-09-17" }, { "report_id": "SEM-EVIDENCE-0011", "slug": "gold-embrittlement-of-solder-joints", "title": "Gold Embrittlement of Solder Joints", "abstract": "This expanded paper draws on solder-joint investigations performed over more than 20 years. It examines eutectic tin-lead, SN62, Sn-Ag, and SAC305 joints using BSE SEM imaging, EDS, image analysis, fracture-surface examination, plating cross-sections, and mass-balance calculations. The paper treats approximately 3 wt% gold as a useful screening value while showing why average gold concentration alone can be misleading. Case evidence includes localized Au-Sn segregation below the calculated joint average, agreement and disagreement between chemistry and image area, Cu- and Ni-bearing reaction products in lead-free systems, an extreme SAC305 transformation, thin die-attach damage during cool-down, anomalous connector plating, thermal-aging effects, and low-gold comparison cases.", "failure_modes": [ "gold embrittlement", "brittle solder-joint fracture" ], "technologies": [ "gold embrittlement of tin-based solder joints", "AuSn4", "AuSn2", "gold inventory", "intermetallic volume fraction", "Sn-Pb", "SN62", "Sn-Ag", "SAC305", "Cu-bearing reaction products", "SEM/EDS", "BSE imaging", "image analysis", "fracture surfaces", "thermal aging", "plating verification" ], "materials": [ "gold", "solder", "intermetallic compounds" ], "methods": [ "metallographic cross-sectioning", "SEM", "EDS" ], "keywords": [ "gold embrittlement of tin-based solder joints", "AuSn4", "AuSn2", "gold inventory", "intermetallic volume fraction", "Sn-Pb", "SN62", "Sn-Ag", "SAC305", "Cu-bearing reaction products", "SEM/EDS", "BSE imaging", "image analysis", "fracture surfaces", "thermal aging", "plating verification", "gold embrittlement", "brittle solder-joint fracture", "gold", "solder", "intermetallic compounds", "metallographic cross-sectioning", "SEM", "EDS" ], "audience": [ "failure-analysis engineers", "materials engineers", "reliability engineers", "soldering-process engineers", "electronics-packaging engineers", "manufacturing engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "150.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/gold-embrittlement-of-solder-joints.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0023", "slug": "anodized-aluminum-defects", "title": "Defects in Anodized and Chemically Converted Aluminum Surfaces", "abstract": "Appearance is evidence, but it is not a mechanism. This paper brings together SEM Lab case evidence on anodized and chemically converted aluminum, including thickness variation, cracking, missing coating, pitting, deposits, ionic contamination, seal-related staining, machining damage, and wear transfer. Optical examination, SEM/EDS, cross sections, process history, and functional requirements are used to distinguish surface deposits from coating defects and substrate damage. The paper connects each condition with engineering consequences and the next measurement or process check.", "failure_modes": [ "thickness variation", "cracking", "missing coating", "pitting", "ionic contamination", "wear transfer" ], "technologies": [ "anodizing", "chemical conversion coating", "surface preparation" ], "materials": [ "aluminum alloys", "anodic oxide", "chromate conversion coating", "nonchromate conversion coating" ], "methods": [ "optical microscopy", "SEM", "EDS", "cross-section analysis" ], "keywords": [ "anodized aluminum", "conversion coating", "coating thickness", "corrosion", "sealing", "machining damage" ], "audience": [ "materials engineers", "manufacturing engineers", "process engineers", "failure-analysis engineers", "quality engineers" ], "availability": [ "individual_purchase", "member_library" ], "price": { "amount": "100.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/anodized-aluminum-defects.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-10-15" }, { "report_id": "SEM-EVIDENCE-0018", "slug": "solder-joint-analysis", "title": "Solder Joint Analysis", "abstract": "This paper covers techniques for analyzing solder joints and highlights SEM Lab capabilities in solder-joint evaluation and failure analysis. The source page specifically identifies metallurgical cross-sectioning, SEM/EDS analysis, failure analysis, and computational metallurgical analysis as part of the paper's scope. The page also states that the analysis results are essential for credible design, process, and product failure analysis. That positions the paper as a broad solder-joint reference rather than a narrow mechanism note.", "failure_modes": [ "solder-joint failure", "metallurgical defects" ], "technologies": [ "solder joint analysis", "metallurgical cross-sectioning", "SEM/EDS", "solder-joint failure analysis", "computational metallurgical analysis", "design and process evaluation" ], "materials": [ "solder", "intermetallic compounds" ], "methods": [ "metallurgical cross-sectioning", "SEM", "EDS", "computational metallurgical analysis" ], "keywords": [ "solder joint analysis", "metallurgical cross-sectioning", "SEM/EDS", "solder-joint failure analysis", "computational metallurgical analysis", "design and process evaluation", "solder-joint failure", "metallurgical defects", "solder", "intermetallic compounds", "SEM", "EDS" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "materials engineers", "reliability engineers", "product engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "55.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/solder-joint-analysis.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0020", "slug": "solder-mask-defects-electrical-failure", "title": "Solder Mask Defects and Their Role in Electrical Failure", "abstract": "This case-based paper explains when solder-mask defects contribute directly to electrical failure and when mask condition is only one factor in a mixed-cause investigation. It connects incomplete coverage, aperture misregistration, incomplete via tenting, mechanical damage, contamination, and below-mask corrosion with physical evidence from eight anonymized SEM Lab cases. The paper emphasizes that mask thickness, composition, cracking, blistering, or EDS detection of mask constituents does not independently establish root cause. Defensible conclusions must also agree with the electrical path, board geometry, conductor clearance, contamination, moisture, voltage stress, process history, and comparison samples.", "failure_modes": [ "hi-pot breakdown", "corrosion", "open circuit", "electrical leakage", "solder-joint geometry distortion" ], "technologies": [ "solder mask defects and electrical failure", "incomplete solder-mask coverage", "hi-pot breakdown", "aperture misregistration", "BGA solder-joint geometry", "incomplete via tenting", "corrosion", "ionic contamination", "electrical leakage", "conductor clearance", "SEM/EDS interpretation" ], "materials": [ "solder mask", "copper conductors", "printed wiring boards", "flux residue" ], "methods": [ "optical microscopy", "SEM", "EDS", "cross-sectioning", "electrical failure localization" ], "keywords": [ "solder mask defects and electrical failure", "incomplete solder-mask coverage", "hi-pot breakdown", "aperture misregistration", "BGA solder-joint geometry", "incomplete via tenting", "corrosion", "ionic contamination", "electrical leakage", "conductor clearance", "SEM/EDS interpretation", "open circuit", "solder-joint geometry distortion", "solder mask", "copper conductors", "printed wiring boards", "flux residue", "optical microscopy", "SEM", "EDS", "cross-sectioning", "electrical failure localization" ], "audience": [ "failure-analysis engineers", "reliability engineers", "printed-circuit-board engineers", "manufacturing engineers", "process engineers", "quality engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "60.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/solder-mask-defects-electrical-failure.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-03" }, { "report_id": "SEM-EVIDENCE-0019", "slug": "solder-flux-associated-failures-sample-report", "title": "Solder-Flux-Associated Failures in Electronic Assemblies", "abstract": "This free 10-page sample report demonstrates how SEM Lab connects electrical behavior, failure-site location, SEM imaging, EDS chemistry, process history, and evidence limits in a clear technical deliverable. Six anonymized cases show how retained solder-flux residue can contribute to moisture-sensitive leakage, corrosion, electrochemical migration, and combined manufacturing defects. The report also provides a failure-analysis sequence and practical process controls. It is published as a composite marketing example so prospective clients can evaluate the structure, evidence traceability, and calibrated conclusion language used in SEM Lab technical reporting.", "failure_modes": [ "moisture-sensitive leakage", "corrosion", "electrochemical migration", "flux entrapment" ], "technologies": [ "solder-flux-associated failures in electronic assemblies", "flux residue", "corrosion", "electrochemical migration", "electrical leakage", "cleaning", "drying", "SEM", "EDS", "evidence interpretation" ], "materials": [ "solder flux residue", "copper", "immersion silver", "solder mask" ], "methods": [ "electrical testing", "optical microscopy", "SEM", "EDS", "cross-sectioning", "ion chromatography" ], "keywords": [ "solder-flux-associated failures in electronic assemblies", "flux residue", "corrosion", "electrochemical migration", "electrical leakage", "cleaning", "drying", "SEM", "EDS", "evidence interpretation", "moisture-sensitive leakage", "flux entrapment", "solder flux residue", "copper", "immersion silver", "solder mask", "electrical testing", "optical microscopy", "cross-sectioning", "ion chromatography" ], "audience": [ "failure-analysis engineers", "manufacturing engineers", "process engineers", "reliability engineers", "quality engineers", "technical managers" ], "availability": [ "free_public_download" ], "price": null, "purchase_url": "https://www.semlab.com/assets/sample-report/solder-flux-associated-failures-sample-report.pdf", "page_url": "https://www.semlab.com/sample-failure-analysis-report.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0014", "slug": "intermetallics-in-solder-joints", "title": "Intermetallics in Solder Joints", "abstract": "This paper explains why intermetallic compounds in solder joints are not a simple \"good\" or \"bad\" issue. It covers the basic role of intermetallic layers, why excessive intermetallic formation can damage joint performance, and why the absence of expected interfacial intermetallics can indicate a process or material problem. The paper discusses several intermetallic systems that are important in electronics work, including Cu6Sn5, Cu3Sn, Ni3Sn4, AuSn4, and Ag3Sn. It also includes discussion of gold embrittlement, volume-fraction effects, and ternary intermetallic phases that can contribute to brittle interfacial behavior.", "failure_modes": [ "excessive intermetallic growth", "brittle interfacial fracture" ], "technologies": [ "solder-joint intermetallic compounds", "gold embrittlement", "Cu-Sn intermetallics", "Ni-Sn intermetallics", "Ag-Sn intermetallics", "interfacial solder-joint microstructure" ], "materials": [ "Cu6Sn5", "Cu3Sn", "Ni3Sn4", "AuSn4", "Ag3Sn" ], "methods": [ "metallographic cross-sectioning", "SEM", "EDS" ], "keywords": [ "solder-joint intermetallic compounds", "gold embrittlement", "Cu-Sn intermetallics", "Ni-Sn intermetallics", "Ag-Sn intermetallics", "interfacial solder-joint microstructure", "excessive intermetallic growth", "brittle interfacial fracture", "Cu6Sn5", "Cu3Sn", "Ni3Sn4", "AuSn4", "Ag3Sn", "metallographic cross-sectioning", "SEM", "EDS" ], "audience": [ "electronics failure-analysis engineers", "manufacturing engineers", "materials engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "45.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/intermetallics-in-solder-joints.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0005", "slug": "failure-analysis-of-leds", "title": "Failure Analysis of LEDs", "abstract": "This paper covers recurring LED failure modes and the practical failure-analysis approach used to evaluate them. The source page describes intermittent or no-light symptoms, and it notes that LED failures often involve de-bonding of the lens material from the cup or die surface due to thermal-expansion mismatch and thermal stress. The paper also appears to summarize other failure modes seen in SEM Lab LED work, including die attach failure, die cracking, wedge bond failure, and ball bond failure. The overall pattern is that many of these failures are induced by mechanical or thermo-mechanical stresses.", "failure_modes": [ "die cracking", "die-attach failure", "wire-bond failure", "lens debonding" ], "technologies": [ "LED failure analysis", "die attach failure", "die cracking", "wedge bond failure", "ball bond failure", "thermo-mechanical stress", "lens de-bonding" ], "materials": [ "semiconductor die", "bond wire", "lens polymer" ], "methods": [ "SEM", "component examination" ], "keywords": [ "LED failure analysis", "die attach failure", "die cracking", "wedge bond failure", "ball bond failure", "thermo-mechanical stress", "lens de-bonding", "die-attach failure", "wire-bond failure", "lens debonding", "semiconductor die", "bond wire", "lens polymer", "SEM", "component examination" ], "audience": [ "electronics failure-analysis engineers", "reliability engineers", "component engineers", "manufacturing engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "20.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/failure-analysis-of-leds.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" }, { "report_id": "SEM-EVIDENCE-0002", "slug": "diffusion-barrier-plating-in-electronics", "title": "Diffusion Barrier Plating in Electronics", "abstract": "This paper covers the use of diffusion barriers in electronics manufacturing and the practical reasons they matter. The source page notes that diffusion barriers have been used for decades, but that SEM Lab still sees cases where barrier layers are omitted when they likely should have been used. The page positions the paper as a series of examples illustrating diffusion-barrier use in electronics manufacturing and links the issue directly to soldering-process quality and solder-joint reliability. That makes the paper useful both as a microstructural reference and as a process-selection reference.", "failure_modes": [ "barrier-layer omission", "interfacial degradation" ], "technologies": [ "diffusion barrier plating in electronics", "plating systems", "solder-joint reliability", "microstructural evaluation", "barrier layers", "manufacturing process quality" ], "materials": [ "diffusion-barrier plating", "solder" ], "methods": [ "SEM", "metallographic cross-sectioning" ], "keywords": [ "diffusion barrier plating in electronics", "plating systems", "solder-joint reliability", "microstructural evaluation", "barrier layers", "manufacturing process quality", "barrier-layer omission", "interfacial degradation", "diffusion-barrier plating", "solder", "SEM", "metallographic cross-sectioning" ], "audience": [ "electronics failure-analysis engineers", "manufacturing engineers", "materials engineers", "plating engineers", "reliability engineers" ], "availability": [ "individual_purchase" ], "price": { "amount": "30.00", "currency": "USD" }, "purchase_url": "https://www.semlab.com/papers.html#catalog", "page_url": "https://www.semlab.com/reports/diffusion-barrier-plating-in-electronics.html", "author": "Ed Hare, PhD", "publisher": "SEM Lab, Inc.", "date_modified": "2026-08-01" } ] }