256K x 16 Bit CMOS Video RAM
64-Pin SSOP package
Post decapsulation BSE SEM image of fuse banks on the die surface.
Fuse blown (on purpose) to configure device.
Check out SEM Lab, Inc. to learn more.
The device exhibited a metallic short between pin-5 and an internal circuit element (a resistor that would normally be isolated). The short appeared to be solder material (primarily tin) from the pin-5 termination that flowed into the device due to excessive temperature exposure during assembly.
Fig. A – Solid-State Relay
Fig. B – Decapsulated, bottom side
Fig. C – Metallic short between pin-5 and an internal circuit
Check out SEM Lab, Inc. to learn more.
This Base-Metal-Electrode Multilayer-Chip-Capacitor (BME MLCC) exhibited some type of manufacturing problem with knit line fractures and excessive internal porosity.
Check out SEM Lab, Inc. to learn more.
Optical image of glass rectifier diode.
The location of the diode breakdown site at the edge of die and the size of the melt pipe suggest this is ESD damage.
Check out SEM Lab, Inc. to learn more.
Check out SEM Lab, Inc. to learn more.
This is an optical image of a shorted multilayer chip capacitor that shorted internally.
This is a BSE SEM image of the same capacitor after microsectioning that shows the original short developed at the intersection of a fracture that bridged the plates.
The original fracture was most likely caused by one of two stresses, (1) thermal shock due to reflow or touch up soldering or (2) bending stresses due to depaneling or subsequent bending of the CCA.
Check out SEM Lab, Inc. to learn more.
1-mil diameter gold bond wire fuses at ~ 1 amp of DC current.
Check out SEM Lab, Inc. to learn more.
Check out SEM Lab, Inc. to learn more.
Check out SEM Lab, Inc. to learn more.
Check out SEM Lab, Inc. to learn more.