EOS on GaAlP LED

Posted on October 6, 2014October 3, 2017 by Ed Hare PhD

Electrical overstress damage of GaAlP LED.

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BGA warpage

Posted on October 3, 2014October 3, 2017 by Ed Hare PhD

BGA warpage causes solder joint fracture, collapsed central solder balls, and head-in-pillow defects.

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EOS Dual Op Amp

Posted on September 29, 2014October 3, 2017 by Ed Hare PhD

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Double-Dumet diode

Posted on September 26, 2014October 3, 2017 by Ed Hare PhD

Double-Dumet diode pulled apart by thermal stress.

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Corroded inductor windings

Posted on September 22, 2014October 3, 2017 by Ed Hare PhD

Corroded inductor windings on SMD part due to flux wicking.

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EOS damage on VDD

Posted on September 15, 2014October 3, 2017 by Ed Hare PhD

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EOS fused bond wire

Posted on September 10, 2014October 3, 2017 by Ed Hare PhD

EOS failure resulted in fused bond wire.

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Marking on transistor die

Posted on September 9, 2014January 17, 2019 by Ed Hare PhD

This was an interesting die marking on a transistor die that appears to be over the top of active signal runs. This occasionally results in unintended electrical performance issues.

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Welded relay contact

Posted on September 8, 2014October 3, 2017 by Ed Hare PhD

Welded relay contact.

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Inner Layer Separation

Posted on September 5, 2014October 3, 2017 by Ed Hare PhD

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