Failure Analysis and Scanning Electron Microscopy

Call To Action

Call To Action

Failure Analysis and Scanning Electron Microscopy Services

LEARN MORE

  Call or text 425.335.4400      Email  

  • SEM Lab, Inc.
  • Services
    • Failure Analysis
    • Electronic Component Failure Analysis
      • F/A of Capacitors
        • Film Capacitors
      • F/A of Resistors
        • Chip Resistor Corrosion
      • F/A of Inductors
      • F/A of Diodes
      • F/A of Transformers
      • F/A of LEDs
      • F/A of ICs
      • F/A of PWBs
      • F/A of BGAs
      • F/A of PCBAs
      • F/A of Medical Devices
      • Identifying Counterfeit Parts
      • PWB Construction Analysis
    • Materials Analysis
      • Solder Joint Analysis
        • Modeling BGA Solder Joints
        • BGA Assembly Verification
        • EDS Data from Sn-Pb Standards
        • Lead Free Solder Analysis
      • Particle Analysis
      • Fiber Analysis
    • FTIR Analysis
      • FTIR of Plastic Parts
    • Scanning Electron Microscopy
    • Microscopy
    • EDS Analysis
      • Thin Film Thickness Measurements
      • EDS Analysis of Polymers
      • EDS Analysis of Alloy Plating
    • Plating Thickness Measurements
    • Quality Control
      • ENIG Quality Control
  • Examples
    • Devices
    • Materials
    • Cross Sections
    • Miscellaneous
  • Request for Quote
  • Papers
    • Intermetallics in Solder Joints
    • Failure Analysis of BGAs
    • Failure Analysis of LEDs
    • Gold Embrittlement of Solder Joints
    • Failure Analysis of PCBAs
    • Diffusion Barrier Plating in Electronics
    • FTIR Analysis
    • Images of Failures in Microelectronics Packaging
    • Failure Analysis of Aluminum Electrolytic Capacitors
    • Solder Joint Analysis
    • BGA Assembly Verification
    • HASL Finish on PWBs
    • PWB Failure Analysis
    • Solder Flux Residue – Part 1
    • Solder Flux Residue – Part 2
  • Blog
  • Contact Us

LED die fracture

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

LED die fracture

Check out SEM Lab, Inc.  to learn more.

Leave a comment

Fractured solder joint

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

fractured joint

Check out SEM Lab, Inc.  to learn more.

Leave a comment

Electromigration short

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

electromigration short

Check out SEM Lab, Inc.  to learn more.

Leave a comment

MLCC firing cracks

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

MLCC firing cracks

Check out SEM Lab, Inc.  to learn more.

Leave a comment

Ta-cap failure

Posted on September 2, 2014September 29, 2020 by Ed Hare PhD

Check out SEM Lab, Inc.  to learn more.

Leave a comment

Over crimped

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

Over crimped

Check out SEM Lab, Inc.  to learn more.

Leave a comment

Suspect wedge bond

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

Suspect wedge bond

Check out SEM Lab, Inc.  to learn more.

Leave a comment

BGA ball fail

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

BGA ball fail

Check out SEM Lab, Inc.  to learn more.

Leave a comment

Bad HASL

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

Bad HASL

Check out SEM Lab, Inc.  to learn more.

Leave a comment

LED bond failure

Posted on September 2, 2014October 3, 2017 by Ed Hare PhD

LED bond failure

Check out SEM Lab, Inc.  to learn more.

Leave a comment

Posts navigation

← Older posts
Newer posts →

Recent Posts

  • PCBA bending
  • Failure Analysis vs Testing
  • Electronic Connectors
  • LED Failures
  • Vias in Printed Circuit Boards
  • Flux Cleaning is Essential
  • Premature Failure of WLEDs
  • ENIG Analysis
  • Diode bridge
  • BGA Solder Joint Simulation
  • QFN Failures
  • PWB Quality Problems
  • Al Bond Pad with Ti-W Barrier
  • Thin Film Thickness Measurements
  • EOS fused bond wire
  • EOS Damaged Op Amp
  • BGA Assembly Verification
  • Contamination on MLCC Termination
  • MLCC Knit Line Related Failures
  • CMOS Flip-Flop IC
  • Failure Analysis of PWBs
  • Corrosion Failures
  • Solder Joint Failure Modes
  • Glass Rectifier Diode
  • BGA Pad Cratering
  • BGA Solder Joint Microsection
  • BGA Solder Joint Height
  • Microsections
  • MLCC knit line failure
  • Head-in-pillow defect
  • IR LED Open Circuit
  • Dual Op Amp
  • MELF Resistor
  • SMT Transformer
  • LED Bond Wire Break
  • Chip Components
  • Microcontroller failure
  • QFN Solder Joint Evaluation
  • Connector Contamination
  • Thermal Stress or EOS
  • PWB Short
  • Creep Rupture Failure
  • Mechanical Overstress of Resistor Solder Joints
  • BGA warpage
  • VD on PCB
  • Pb-dendrites
  • Corrosion of Flex Assembly
  • Optical vs SEM imaging
  • FTIR of Unknown Plastic
  • Counterfeit AE Capacitors
  • Nichrome Resistors
  • Yellowed resistors
  • ENIG Discoloration
  • Laminate Damage
  • Wear Out of Aluminum Electrolytic Capacitor
  • Suspected tin whisker
  • Solder Joint Fatigue
  • Failure of IR LED
  • Residue on PCBA
  • MLCC Bending Fracture
  • FPGA ECM short
  • Tin Whiskers
  • LED Lamp Flickers
  • Gold Embrittlement
  • MLCC manufacturing flaw
  • Diode Short
  • ESD Damage in Zener Diode
  • Severe corrosion on PCBA
  • PCBA Corrosion
  • Shorted FET
  • Dendritic Growth – Shorts on PCBA
  • ECM of PWB Battery Contacts
  • Bad Board Design
  • Solder Joint Failure
  • Tombstoning of SMD Inductor
  • Silver Sulfide Crystals
  • IC Bond Pad Corrosion
  • Crystal Frequency Shift
  • Damage in BGA Device
  • Manufacturing flaws in ceramic capacitor
  • Red Phosphorus in IC Molding Compound
  • ENIG corrosion problem
  • FET failure
  • Diode failure
  • Ta-cap breakdown
  • MLCC bending fracture
  • Internal PWB Short
  • Microsection of gold-plated contact
  • Trace fractured on Rigid Flex
  • EOS failure of Power MOSFET
  • Black Pad Syndrome
  • Power Transistor
  • Blue LED
  • Tin Whiskers
  • Bad diodes
  • EDS shows Teflon Contamination
  • Tin whisker
  • Residue under BGA
  • Fuses on Video RAM
  • Solid-State Relay
  • Knit Line Fracture and Porosity
  • ESD damaged diode
  • Silver Sulfide Growth
  • MLCC short
  • Fused bond wire
  • Skip plating
  • Resin Starvation
  • Quad NOR ICs
  • LED Failure
  • Electromigration short
  • Stranded wire failure
  • Corroded PTH-via
  • Tin-lead whisker
  • SAC solder joint
  • SMD diode short
  • Excess solder gull-lead joint
  • Decapsulated diode
  • BGA die crack
  • EOS on GaAlP LED
  • BGA warpage
  • EOS Dual Op Amp
  • Double-Dumet diode
  • Corroded inductor windings
  • EOS damage on VDD
  • EOS fused bond wire
  • Marking on transistor die
  • Welded relay contact
  • Inner Layer Separation
  • Bond cratering microsection
  • MLCC dielectric porosity
  • Diode EOS
  • MLCC flaws
  • Parylene coating
  • Diode EOS
  • BGA gas voids
  • Distorted BGA
  • PLCC bond fail
  • Conductive residue
  • PTH barrel crack
  • Missing BGA ball
  • LED die fracture
  • Fractured solder joint
  • Electromigration short
  • MLCC firing cracks
  • Ta-cap failure
  • Over crimped
  • Suspect wedge bond
  • BGA ball fail
  • Bad HASL
  • LED bond failure
  • LED failure
  • Resistor network solder joint fracture
  • PTH via barrel crack
  • EOS failure
  • ENIG problem
  • Black pad syndrome
  • Poorly drilled hole
  • IC voltage transient
  • Wire bond
  • Bond cratering
  • Chip resistor fracture
  • Via corrosion
  • MLCC knit line failure
  • SOT23 diode
  • Chip resistor corrosion
  • BGA Solder Mask Defined Pads
  • PTH Pad Lift
  • LED microsection
  • MLCC flex fracture

Recent Comments

  • Ed Hare PhD on Diode Short
  • Leo Ranta on Diode Short
  • Ed Hare PhD on Report 3015 Download
  • Vicente Zamora on Report 3015 Download
  • Mike Rohlik on PWB Quality Problems

Categories

  • Uncategorized

Meta

  • Log in
  • Entries feed
  • Comments feed
  • WordPress.org

Contact Info

© 2024 SEM Lab Inc. | Privacy Statement | 425-335-4400 | info@semlab.com