Case 1680 ยท Public preview
Normal ENIG Morphology Can Rule Against BGA Black Pad
A board population required comparative assessment for its relative risk of BGA solder-joint failure associated with black pad.
MicrosectioningMechanical pryingSEMEDSZAF estimationBoard-lot comparison
What the evidence preview establishes
The examined lot showed the lowest black-pad risk among the compared populations. Sections contained no solder-joint fractures or phosphorus-rich interfacial layer, and fracture surfaces lacked nickel grain-boundary hyper-corrosion.
Why this case matters
A black-pad diagnosis requires converging chemistry, morphology, and fracture-location evidence. Elevated phosphorus alone should not outweigh intact joints, normal intermetallic, and absence of nickel hyper-corrosion.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.