Case 882 ยท Public preview
Flux-Filled BGA Voids Can Remove Most of a Joint's Load Area
An assembly failed after mechanical testing, with suspected open BGA joints near the edge implicated by the electrical signature.
Fracture-surface examinationSEMEDSComparative joint mappingMechanical separation
What the evidence preview establishes
The likely joints failed through excessive flux-filled voids at the BGA ball interface. The voids removed more than half of the load-bearing area in some joints. Barium in trapped flux suggested a possible flux and solder-mask incompatibility. Minor black-pad evidence was a secondary concern.
Why this case matters
Evaluate BGA voids by lost load-bearing area, not only void count. If residue contains solder-mask constituents, test flux, mask, reflow, and outgassing compatibility while separately assessing ENIG integrity.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.