Case 1069 ยท Public preview
Moisture and Ionic Residue Can Exploit Weak Connector Plating
Mated charging contacts developed severe corrosion and electrical contact failures.
SEMEDSIn-situ contact inspectionMicrosectioningPlating measurementStock-part comparison
What the evidence preview establishes
Condensed moisture combined with chloride, bromide, potassium, and other ionic residues to form a corrosive electrolyte. Porous, variable, separated, or locally missing plating increased access to the copper base.
Why this case matters
Connector corrosion is often a system interaction. Evaluate environment, cleanliness, and plating integrity together rather than treating gold thickness alone as adequate protection.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.