Flux and Detergent Residues Beneath Connectors Can Defeat Electrical Isolation

What the evidence preview establishes

Residual activated flux and incompletely rinsed detergent left chloride and surfactant material beneath connector bodies. Moisture converted these residues into conductive leakage paths and promoted corrosion of copper, solder, and connector metals.

Why this case matters

A cleaning process can mobilize flux yet still leave detergent and activator residue in low-clearance geometry. Controls should be examined for latent process evidence, not assumed clean merely because they have not failed.