Residue Trapped Beneath Connectors Can Develop into a Destructive ECM Short

What the evidence preview establishes

Chloride-bearing residue, tin-oxide corrosion product, moisture, and electric field supported an electrochemical-migration short between power and ground beneath a connector. The resulting high-current event fused or vaporized pads, plated holes, and internal copper.

Why this case matters

Connector bodies create capillary spaces that are difficult to clean and inspect. Ionic cleanliness, moisture condensation, conductor spacing, current limiting, and trapped-residue geometry must be considered together when assessing ECM risk.