Case 339 ยท Public preview
Comparative EDS Can Eliminate a Suspected Contamination Cause
Solder-joint failures raised concern that organic contamination within electroplated copper pads differed between problematic and comparison boards.
Cross-section reviewSEMComparative EDSPeak-ratio analysis
What the evidence preview establishes
Comparative EDS found no significant carbon-to-copper or oxygen-to-copper difference among the board groups. The solder-joint failures therefore were unlikely to have resulted from organic contamination in the electroplated copper. Silicon differences were not linked to failure.
Why this case matters
A useful failure analysis can eliminate a suspected cause. Acquire comparison spectra under identical conditions, normalize to the substrate, and avoid assigning significance to a compositional difference without a credible failure pathway.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.