Case 1822 ยท Public preview
Mechanical Laminate Damage Can Enable Internal Electrochemical Migration
Circuit assemblies developed low resistance between internal control signals and chassis ground.
Electrical testingThermal fault localizationSequential microsectioningOptical microscopySEMEDS
What the evidence preview establishes
Copper migration formed conductive paths between internal signal traces and ground lands through mechanically damaged laminate and adhesive. Crazing, measling, and resin/glass separation supplied the pathways, with chloride contamination potentially contributing.
Why this case matters
Internal leakage near bonded metal structures should prompt examination for mechanical laminate damage. Removing electrical symptoms by drying or handling does not eliminate a migration path preserved in microcracks.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.