Case 1668 ยท Public preview
Voided Adhesive Can Create a Hidden Electrochemical-Migration Path
Two circuit assemblies exhibited low-resistance leakage or suspected shorting beneath adhesively mounted passive components.
Resistance measurementOptical microscopyMicrosectioningSEMEDSAdhesive-interface examination
What the evidence preview establishes
Electrochemical migration beneath the devices was the most likely cause of the leakage. Ionic contamination, voltage bias, and moisture acted through large adhesive voids and poorly bonded interfaces that provided protected capillary paths between conductors.
Why this case matters
Component adhesive must not become a reservoir for activated flux. Control voiding, cure, cohesive strength, and interface adhesion so moisture cannot convert hidden residue beneath a component into a migration path.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.