Coupled Devices Can Preserve Evidence of a Common Overstress Event

What the evidence preview establishes

Both devices failed through gross electrical overstress. Fused copper in the controller and melted gold in the protection diode demonstrated extreme localized heating, although the sequence between an initiating ESD event and secondary overcurrent could not be resolved.

Why this case matters

When multiple protection-path devices fail together, map their circuit relationship before assigning ESD as the sole cause. Melted metals establish energy severity, not necessarily event sequence.