Case 2153 ยท Public preview
A Solder Shunt Beneath a Power Package Can Create a Board-Level Short
A power board exhibited a low-resistance short between its supply and ground rails with apparent heating near a switching device.
Electrical fault isolationOptical microscopyX-ray imagingComponent removalSEMEDS
What the evidence preview establishes
The short most likely originated from a solder shunt between a switching pin and the grounded thermal pad beneath a power device. Residual solder on the removed package provided physical witness to a bridge that could explain the board short and secondary heating.
Why this case matters
For a board-level short beneath a thermal-pad package, isolate nearby components electrically and preserve the package underside during removal. Residual solder can reveal a hidden pin-to-pad bridge even when optical and X-ray inspection are inconclusive.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.