Case 1944 ยท Public preview
An Electrical Failure Near a BGA Is Not Necessarily a Solder-Joint Failure
An assembly failed after suspected mechanical overstress, and three BGA devices were considered the most likely fault locations.
Optical microscopyBGA microsectioningSEMEDSJoint-integrity comparisonArtifact assessment
What the evidence preview establishes
The examined BGA solder joints were intact. More credible mechanical evidence appeared within the packages: one die was fractured, while another device had deformed pads and local separation at a pad-to-molding-compound interface.
Why this case matters
Do not equate a suspected BGA location with a solder-joint fracture. Preserve the package for nondestructive acoustic imaging when possible, verify joint integrity, inspect package pads and die, and explicitly separate service damage from sectioning artifacts.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.