Case 2453 ยท Public preview
Wave-Solder Heating Can Initiate Latent Debonding and LED Wear-Out
Three potted LED lamps were open circuit at the same LED position, although the remaining LEDs continued to operate.
Electrical testingOptical microscopyMicrosectioningSEMThermal-process review
What the evidence preview establishes
Lens material debonded from the bottom of the LED cup, most likely during wave-solder thermal overstress. Potting voids and a nearby resistor reduced thermal margin; subsequent heating produced encapsulant fractures around the bond wire and apparent wire discontinuities that accelerated wear-out.
Why this case matters
A brief assembly-process excursion can create latent package damage that later appears as wear-out. Thermal-path voids, adjacent heat sources, encapsulant adhesion, and bond-wire strain must be evaluated together.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.