Case 2314 ยท Public preview
Solder Can Consume an MLCC Termination and Create an Incipient Crack
Two MLCCs fractured and separated from their board, leaving much of the soldered termination behind.
Optical microscopySEMSequential microsectioningEDSElemental mappingFracture-origin comparison
What the evidence preview establishes
During reflow, solder consumed the Ag-Pd termination and formed a Sn-Pb-Ag-Pd layer. Its weak interface with the ceramic created an incipient flaw that required little additional stress to propagate.
Why this case matters
When an MLCC leaves its termination on the board, examine metallization consumption rather than assuming ordinary flex cracking. Evaluate solder compatibility and use a diffusion barrier when required.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.