Bond-Pad Corrosion Can Produce Both Opens and Inter-Pin Leakage

What the evidence preview establishes

Phosphorus-associated corrosion of aluminum bond pads was the most likely failure mechanism. Aluminum loss explained an open bond-pad connection, while electrolyte and migrated aluminum could also account for reduced signal-to-signal impedance.

Why this case matters

Bond-pad corrosion can create both hard opens and unstable leakage. Correlate electrical measurements with localized aluminum loss and contamination, but do not assign the contaminant source without comparison evidence from die processing and package materials.