Recent Posts
- PCBA bending
- Failure Analysis vs Testing
- Electronic Connectors
- LED Failures
- Vias in Printed Circuit Boards
- Flux Cleaning is Essential
- Premature Failure of WLEDs
- ENIG Analysis
- Diode bridge
- BGA Solder Joint Simulation
- QFN Failures
- PWB Quality Problems
- Al Bond Pad with Ti-W Barrier
- Thin Film Thickness Measurements
- EOS fused bond wire
- EOS Damaged Op Amp
- BGA Assembly Verification
- Contamination on MLCC Termination
- MLCC Knit Line Related Failures
- CMOS Flip-Flop IC
- Failure Analysis of PWBs
- Corrosion Failures
- Solder Joint Failure Modes
- Glass Rectifier Diode
- BGA Pad Cratering
- BGA Solder Joint Microsection
- BGA Solder Joint Height
- Microsections
- MLCC knit line failure
- Head-in-pillow defect
- IR LED Open Circuit
- Dual Op Amp
- MELF Resistor
- SMT Transformer
- LED Bond Wire Break
- Chip Components
- Microcontroller failure
- QFN Solder Joint Evaluation
- Connector Contamination
- Thermal Stress or EOS
- PWB Short
- Creep Rupture Failure
- Mechanical Overstress of Resistor Solder Joints
- BGA warpage
- VD on PCB
- Pb-dendrites
- Corrosion of Flex Assembly
- Optical vs SEM imaging
- FTIR of Unknown Plastic
- Counterfeit AE Capacitors
- Nichrome Resistors
- Yellowed resistors
- ENIG Discoloration
- Laminate Damage
- Wear Out of Aluminum Electrolytic Capacitor
- Suspected tin whisker
- Solder Joint Fatigue
- Failure of IR LED
- Residue on PCBA
- MLCC Bending Fracture
- FPGA ECM short
- Tin Whiskers
- LED Lamp Flickers
- Gold Embrittlement
- MLCC manufacturing flaw
- Diode Short
- ESD Damage in Zener Diode
- Severe corrosion on PCBA
- PCBA Corrosion
- Shorted FET
- Dendritic Growth – Shorts on PCBA
- ECM of PWB Battery Contacts
- Bad Board Design
- Solder Joint Failure
- Tombstoning of SMD Inductor
- Silver Sulfide Crystals
- IC Bond Pad Corrosion
- Crystal Frequency Shift
- Damage in BGA Device
- Manufacturing flaws in ceramic capacitor
- Red Phosphorus in IC Molding Compound
- ENIG corrosion problem
- FET failure
- Diode failure
- Ta-cap breakdown
- MLCC bending fracture
- Internal PWB Short
- Microsection of gold-plated contact
- Trace fractured on Rigid Flex
- EOS failure of Power MOSFET
- Black Pad Syndrome
- Power Transistor
- Blue LED
- Tin Whiskers
- Bad diodes
- EDS shows Teflon Contamination
- Tin whisker
- Residue under BGA
- Fuses on Video RAM
- Solid-State Relay
- Knit Line Fracture and Porosity
- ESD damaged diode
- Silver Sulfide Growth
- MLCC short
- Fused bond wire
- Skip plating
- Resin Starvation
- Quad NOR ICs
- LED Failure
- Electromigration short
- Stranded wire failure
- Corroded PTH-via
- Tin-lead whisker
- SAC solder joint
- SMD diode short
- Excess solder gull-lead joint
- Decapsulated diode
- BGA die crack
- EOS on GaAlP LED
- BGA warpage
- EOS Dual Op Amp
- Double-Dumet diode
- Corroded inductor windings
- EOS damage on VDD
- EOS fused bond wire
- Marking on transistor die
- Welded relay contact
- Inner Layer Separation
- Bond cratering microsection
- MLCC dielectric porosity
- Diode EOS
- MLCC flaws
- Parylene coating
- Diode EOS
- BGA gas voids
- Distorted BGA
- PLCC bond fail
- Conductive residue
- PTH barrel crack
- Missing BGA ball
- LED die fracture
- Fractured solder joint
- Electromigration short
- MLCC firing cracks
- Ta-cap failure
- Over crimped
- Suspect wedge bond
- BGA ball fail
- Bad HASL
- LED bond failure
- LED failure
- Resistor network solder joint fracture
- PTH via barrel crack
- EOS failure
- ENIG problem
- Black pad syndrome
- Poorly drilled hole
- IC voltage transient
- Wire bond
- Bond cratering
- Chip resistor fracture
- Via corrosion
- MLCC knit line failure
- SOT23 diode
- Chip resistor corrosion
- BGA Solder Mask Defined Pads
- PTH Pad Lift
- LED microsection
- MLCC flex fracture