Power and ground plane shorts in multilayer PCBs can be difficult to trace, especially when the root cause lies deep within the laminate structure. This example highlights an internal short caused by resin fracture and delamination, which enabled copper electro-migration across a thin dielectric layer. Understanding failure mechanisms like this is essential for improving PCB reliability in demanding applications. #FailureAnalysis #PCBDesign #ElectroMigration #MaterialsScience