Failure Analysis of ICs
Integrated Circuits (ICs)
Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM/EDS analysis of the device die.
SEM images of failures in integrated circuits (ICs) and a decapsulated IC are shown below.
Other device failure analysis information:
ics
Decapsulated IC.
EOS Failure.
ESD Failure.
Bond pad corrosion.
Bond pad corrosion.
Dendritic growth.
Lifted ball bond.
EOS failure of MOSFET.