Solder Voids
Surface-Open Gas Voids
A solder-void image where the voids are open to the surface near the interface instead of appearing as isolated interior porosity.
Interpretation
Why this image matters
The voids are large enough and close enough to the interface to raise a real question about effective load-bearing area and local stress concentration.
The underlying report described systemic gas voiding and noted that the voids may contribute to creep deformation by amplifying stress in the solder matrix.
It is a good example of the point that void morphology and location matter more than a simple statement that “voids are present.”
Best comparison value
- Explaining why surface-open voids can matter more than buried bulk porosity
- Discussing void morphology rather than void percentage alone
- Teaching contributory process-related solder-joint features