Solder Voids

Surface-Open Gas Voids

A solder-void image where the voids are open to the surface near the interface instead of appearing as isolated interior porosity.

Scale 100 um scale shown
Observed feature Gas voids in solder that are open to the surface near the interface
Likely mechanism Process-related gas voiding that may reduce effective joint area at a critical location
Gas voids open to the solder surface near the joint boundary

Interpretation

Why this image matters

The voids are large enough and close enough to the interface to raise a real question about effective load-bearing area and local stress concentration.

The underlying report described systemic gas voiding and noted that the voids may contribute to creep deformation by amplifying stress in the solder matrix.

It is a good example of the point that void morphology and location matter more than a simple statement that “voids are present.”

solder-voids gas-voids surface-open interface
Use this when

Best comparison value

  • Explaining why surface-open voids can matter more than buried bulk porosity
  • Discussing void morphology rather than void percentage alone
  • Teaching contributory process-related solder-joint features
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