Interfacial Fracture
BGA Interfacial Fracture
A stronger interfacial-fracture image than the earlier overview because the fracture boundary is directly visible at the BGA pad interface.
Interpretation
Why this image matters
The report concluded that the electrical faults were due to brittle interfacial fracture of several BGA solder joints and noted that this type of damage typically occurs under high-strain-rate mechanical loading such as board depanelization, ICT, or mishandling.
This image cleanly separates interfacial fracture from PCB pad cratering. The fracture follows the interface rather than representing laminate damage beneath the pad.
It is a good comparison image whenever you want to explain why seemingly similar BGA failures are not always the same mechanism.
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Use this when
Best comparison value
- Separating interfacial fracture from PCB pad cratering
- Teaching high-strain-rate BGA damage mechanisms
- Comparing interface-following fractures to laminate failures
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