Electrical Overstress
Fused-Open Bond Wire
A high-magnification current-overstress example showing the fused end of a bond wire after open-circuit failure.
Interpretation
Why this image matters
This image gives a clean, close view of what fused-open bond-wire damage can look like after current overload, including end geometry suggestive of melting and resolidification.
The report concluded that both devices failed due to electrical overstress by excessive forward current that caused the bond wire to fuse open. Supporting images in the same set also showed fused gold on the die surface.
It works especially well as a contrast to die-level EOS images because the evidence is concentrated in the interconnect rather than across a broader die region.
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Use this when
Best comparison value
- Separating current-overstress damage from fatigue fracture
- Teaching interconnect-specific EOS evidence
- Comparing wire damage with die-level damage patterns
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