Contamination
Under-Part Ionic Leakage
A geometry-dependent leakage example under a mounted part, showing how some contamination failures are real even when the image is not visually dramatic.
Interpretation
Why this image matters
The report concluded that the device most likely failed due to ionic electrical leakage between pin 5 and the center pad under the part as mounted on the PCBA. It also noted that the condition was bake recoverable and that ESD was not supported as the cause.
This image is a reminder that some contamination-driven failures are highly geometry dependent and may not produce a dramatic standalone visual signature.
It works best as a context-rich leakage example rather than as a pure morphology image.
Best comparison value
- Teaching under-part leakage paths that depend on geometry and spacing
- Explaining bake-recoverable contamination failures
- Contrasting contamination-driven leakage with ESD claims